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Solder paste Sn42Bi58 JF-800905RMA PbFree 25 g, with bismuth, low melting point
Low-melting lead-free solder paste with RMA flux, designed for soldering LED SMD elements. For production and repair. Sn42Bi58 alloy. LOW melting point .
Solder paste is a mixture of solder powder and a gel-like flux.
When heated, the powder fuses in the flux environment to form a solder joint.
Paste based on an RMA grade flux gel. After soldering, flux residues need to be washed out.
Recommended for repair work on LED components that are critical to overheating.
Low temperature solder paste is optimal for soldering LEDs, as well as for assembling double-sided PCBs when soldering the second side of the board (the first is soldered to a higher-temperature paste).
Characteristics:
The chemical composition of the solder alloy in percent:
Storage conditions: at temperatures from+5°C to+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.
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